Directly mounting bear chips on the substrate! A high-density substrate that achieves miniaturization and thinness of devices.
"COB-compatible PWB" is a high-density substrate that directly mounts bare chips onto the board, achieving miniaturization and thinness of devices. It supports both electrolytic gold plating and electroless gold plating, providing stable bonding properties.
By combining this with our unique cavity formation technology, it becomes possible to mount chips within the cavity, further reducing the thickness and size of the product.
Additionally, for the sealing process after chip mounting, it is also possible to form a high sealing dam on the substrate that cannot be achieved with conventional printing inks.
【Features】
■ Chips mounted within the cavity
■ Achieves miniaturization and thinness of devices
■ Supports electrolytic gold plating and electroless gold plating
■ Stable bonding properties
■ Unique mold design reduces dust generation from the edges after exterior pressing
*For more details, please refer to the catalog or feel free to contact us.
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